APAMA C2W
概述
Advanced packaging, thermo-compression for chip-to-wafer, high accuracy flip chip ("HA FC") and high density fan-out wafer level packaging ("HD FOWLP") bonding applications.
活躍中的上架商品
0
服務
檢驗、保險、評估、物流
最熱門的上架商品
- 未找到產品
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Messages
Messages
Messages including contact info may not be shared. We scan, review, and reserve the right to remove sensitive information from all messages to prevent fraud and policy violations.All messages subject to review, review our policy for more info.
6" Fab For Sale from Moov - Click Here to Learn More
