描述
Tel Indy IRAD配置
Asset Description: TEL Furnace Software Version: 6.01 CIM: secs-gem Process: MLD Nitride Main System: Tel Indy Mainframe (1) Factory Interface: FOUP (2) Options System: Gas Detector box (1) Options System: RCU (Rapid Cooling Unit) (1) 208VAC UPS (1) Rapid cooling unit (1)OEM 代工型號說明
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.文檔
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TEL / TOKYO ELECTRON
TELINDY
已驗證
類別
Furnaces / Diffusion
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
103932
晶圓尺寸:
12"/300mm
年份:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
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TEL / TOKYO ELECTRON
TELINDY
類別
Furnaces / Diffusion
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
103932
晶圓尺寸:
12"/300mm
年份:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Tel Indy IRAD配置
Asset Description: TEL Furnace Software Version: 6.01 CIM: secs-gem Process: MLD Nitride Main System: Tel Indy Mainframe (1) Factory Interface: FOUP (2) Options System: Gas Detector box (1) Options System: RCU (Rapid Cooling Unit) (1) 208VAC UPS (1) Rapid cooling unit (1)OEM 代工型號說明
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.文檔
無文檔