描述
INDY B-L配置
Details Attached Poly 3 Process Diff (DPOLY) Furnace Main Body Unit Name - W × D x H Furnace section - 1100 X 3825 X 3631.5 Gas Box - 235 X 800 X 3086.5 Power Box - 1100 X 1100 X 2000 Safety Specification - SEMI S2-0703 / CE Heater Model - Mid-Temp, VMM-56-002 5zone / 500-1000℃ LATEST VERSION - LP Maximum Operation Temperature (℃) - 450℃ ART Control - None N2 Load Lock - Yes Wafer Type - 300mm-SI SEMI STD-Notch Qty of Production Wafers - 100 Boat Operation (Handling Position) - 1 Boat Type (B/E) Software Version (WAVES) - Latest Version A-1-4. Cooling water piping A-1-5. Process Vacuum Line A-1-6. Base plate A-1-7. Fan Filter unit (FFU) A-2-1. Carrier I/O port A-2-2. Boat elevator A-2-3. Auto shutter A-2-4. Buffer stage : 16 ea A-2-5. Wafer counter : 2 eaOEM 代工型號說明
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.文檔
類別
Furnaces / Diffusion
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
129316
晶圓尺寸:
12"/300mm
年份:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELINDY
類別
Furnaces / Diffusion
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
129316
晶圓尺寸:
12"/300mm
年份:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available