描述
Epitaxial Silicon (EPI)配置
Epi Centura 300 - RP (2-chamber) Centura 300 Epi platform configured for reduced-pressure (RP) operation with dual process modules Dual load port factory interface supporting nitrogen purge, compatible with both FOUP and open cassette formats (OCLP) Factory Interface software/hardware revision 5.3 Central wafer transfer module Single-arm robotic handler with magnetic coupling, featuring on-the-fly (OTF) wafer alignment and wafer-on-blade (WOB) sensing capability Integrated pneumatic distribution manifold system Two automated batch loadlock stations equipped with point-of-use vacuum pumps (iPUP) Pair of deposition/process chambers Quartz dome assemblies (top and bottom) for each chamber Dual lamp heating assemblies (upper and lower) Wafer support susceptor assemblies Jet Pack forced-air cooling system Process exhaust and abatement interface Low-temperature optical pyrometry for process monitoring Closed-loop thermal control utilizing optical pyrometers with PID regulation Structural remote frame support configuration Next-generation reduced-pressure gas delivery system with mass flow controllers and valve control Integrated leak detection and interlock safety systems Vacuum architecture includes dedicated iPUP for transfer chamber and high-capacity remote pumps for each process module System controller: c300NT mainframe operating on Windows NT platform Front-end control workstation (FE PC) providing user interface and command/control of the c300NT systemOEM 代工型號說明
Applied Centura RP (reduced pressure) Epi systems.文檔
無文檔
類別
Epitaxial deposition (EPI)
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
134970
晶圓尺寸:
12"/300mm
年份:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA RP EPI
類別
Epitaxial deposition (EPI)
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
134970
晶圓尺寸:
12"/300mm
年份:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Epitaxial Silicon (EPI)配置
Epi Centura 300 - RP (2-chamber) Centura 300 Epi platform configured for reduced-pressure (RP) operation with dual process modules Dual load port factory interface supporting nitrogen purge, compatible with both FOUP and open cassette formats (OCLP) Factory Interface software/hardware revision 5.3 Central wafer transfer module Single-arm robotic handler with magnetic coupling, featuring on-the-fly (OTF) wafer alignment and wafer-on-blade (WOB) sensing capability Integrated pneumatic distribution manifold system Two automated batch loadlock stations equipped with point-of-use vacuum pumps (iPUP) Pair of deposition/process chambers Quartz dome assemblies (top and bottom) for each chamber Dual lamp heating assemblies (upper and lower) Wafer support susceptor assemblies Jet Pack forced-air cooling system Process exhaust and abatement interface Low-temperature optical pyrometry for process monitoring Closed-loop thermal control utilizing optical pyrometers with PID regulation Structural remote frame support configuration Next-generation reduced-pressure gas delivery system with mass flow controllers and valve control Integrated leak detection and interlock safety systems Vacuum architecture includes dedicated iPUP for transfer chamber and high-capacity remote pumps for each process module System controller: c300NT mainframe operating on Windows NT platform Front-end control workstation (FE PC) providing user interface and command/control of the c300NT systemOEM 代工型號說明
Applied Centura RP (reduced pressure) Epi systems.文檔
無文檔