描述
Epitaxial Silicon (EPI)配置
Centura Epi 300 (2-chamber) • FFactory interface module configured with dual nitrogen-purged load ports, supporting both FOUP and open cassette wafer handling (OCLP) FI platform version 5.3 Central transfer chamber for wafer movement Magnetically coupled single-blade wafer handling robot with on-the-fly (OTF) centering and wafer-on-blade (WOB) detection capability Pneumatic distribution manifold assembly Two automated batch loadlock chambers equipped with integrated point-of-use vacuum pumps (iPUP) Dual process reactor chambers Upper and lower quartz dome assemblies within each chamber Top and bottom lamp heating modules Wafer support susceptors Jet Pack air cooling subsystem Process exhaust system Low-temperature pyrometry for process monitoring Closed-loop temperature control using optical pyrometers with PID regulation Remote support frame configuration Reduced-pressure next-generation gas delivery panel with integrated mass flow controllers (MFCs) and valve control Safety features including leak detection and system interlocks Vacuum scheme includes a dedicated iPUP for the transfer chamber and remote high-capacity pumps for each process module c300NT system controller running on a Windows NT operating platform Front-end PC (FE PC) providing operator interface and configuration control of the c300NT systemOEM 代工型號說明
Applied Centura RP (reduced pressure) Epi systems.文檔
無文檔
類別
Epitaxial deposition (EPI)
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
150082
晶圓尺寸:
12"/300mm
年份:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA RP EPI
類別
Epitaxial deposition (EPI)
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
150082
晶圓尺寸:
12"/300mm
年份:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Epitaxial Silicon (EPI)配置
Centura Epi 300 (2-chamber) • FFactory interface module configured with dual nitrogen-purged load ports, supporting both FOUP and open cassette wafer handling (OCLP) FI platform version 5.3 Central transfer chamber for wafer movement Magnetically coupled single-blade wafer handling robot with on-the-fly (OTF) centering and wafer-on-blade (WOB) detection capability Pneumatic distribution manifold assembly Two automated batch loadlock chambers equipped with integrated point-of-use vacuum pumps (iPUP) Dual process reactor chambers Upper and lower quartz dome assemblies within each chamber Top and bottom lamp heating modules Wafer support susceptors Jet Pack air cooling subsystem Process exhaust system Low-temperature pyrometry for process monitoring Closed-loop temperature control using optical pyrometers with PID regulation Remote support frame configuration Reduced-pressure next-generation gas delivery panel with integrated mass flow controllers (MFCs) and valve control Safety features including leak detection and system interlocks Vacuum scheme includes a dedicated iPUP for the transfer chamber and remote high-capacity pumps for each process module c300NT system controller running on a Windows NT operating platform Front-end PC (FE PC) providing operator interface and configuration control of the c300NT systemOEM 代工型號說明
Applied Centura RP (reduced pressure) Epi systems.文檔
無文檔