描述
STS Deep Reactive Ion Si Etcher (Bosch Process) The STS Multiplex DRIE system uses the Bosch process to etch silicon deeply and anisotropic. In addition to the platen RF power supply used for reactive ion etching (RIE), the system is equipped with an inductively coupled plasma (ICP) RF source, which allows independent control of plasma density and DC bias. The system features a water-cooled electrode and helium backside cooling to maintain the sample at a low temperature during processing. It is designed to accommodate and etch 200 mm wafers.配置
無配置OEM 代工型號說明
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.文檔
無文檔
類別
Dry / Plasma Etch
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
64816
晶圓尺寸:
8"/200mm
年份:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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STS
MULTIPLEX ICP
類別
Dry / Plasma Etch
上次驗證: 3 天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
64816
晶圓尺寸:
8"/200mm
年份:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
STS Deep Reactive Ion Si Etcher (Bosch Process) The STS Multiplex DRIE system uses the Bosch process to etch silicon deeply and anisotropic. In addition to the platen RF power supply used for reactive ion etching (RIE), the system is equipped with an inductively coupled plasma (ICP) RF source, which allows independent control of plasma density and DC bias. The system features a water-cooled electrode and helium backside cooling to maintain the sample at a low temperature during processing. It is designed to accommodate and etch 200 mm wafers.配置
無配置OEM 代工型號說明
The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer.文檔
無文檔