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LAM RESEARCH CORPORATION TCP 9600SE
    描述
    Metal Etch
    配置
    無配置
    OEM 代工型號說明
    The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
    文檔

    無文檔

    類別
    Dry / Plasma Etch

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    119772


    晶圓尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    LAM RESEARCH CORPORATION

    TCP 9600SE

    verified-listing-icon
    已驗證
    類別
    Dry / Plasma Etch
    上次驗證: 超過60天前
    listing-photo-3e596b6d484249b4a729f0d3b73ebbcd-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    119772


    晶圓尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Metal Etch
    配置
    無配置
    OEM 代工型號說明
    The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
    文檔

    無文檔

    類似上架商品
    查看全部