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LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
  • LAM RESEARCH CORPORATION TCP 9600SE
描述
無描述
配置
無配置
OEM 代工型號說明
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
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PREFERRED
 
SELLER
類別
Dry / Plasma Etch

上次驗證: 8 天前

Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

125864


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
 
SELLER

LAM RESEARCH CORPORATION

TCP 9600SE

verified-listing-icon
已驗證
類別
Dry / Plasma Etch
上次驗證: 8 天前
listing-photo-266b6e6c857b49e0ac28a20a678cf013-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

125864


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
無配置
OEM 代工型號說明
The TCP 9600SE is a high density, low pressure etch system from Lam’s TCP product line. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer tool, or on the Alliance multichamber cluster platform.
文檔

無文檔

類似上架商品
查看全部