描述
Automatic Epoxy Die Bonders配置
無配置OEM 代工型號說明
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
155116
晶圓尺寸:
未知
年份:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
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BESI / ESEC
2007 SSI plus
類別
Die Bonders / Sorters / Attachers
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
155116
晶圓尺寸:
未知
年份:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Automatic Epoxy Die Bonders配置
無配置OEM 代工型號說明
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.文檔
無文檔