描述
Die Bonder配置
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEM 代工型號說明
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文檔
無文檔
ASM
AD8912
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
62756
晶圓尺寸:
12"/300mm
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
AD8912
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
62756
晶圓尺寸:
12"/300mm
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Die Bonder配置
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEM 代工型號說明
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文檔
無文檔