AD8912
概述
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
活躍中的上架商品
12
服務
檢驗、保險、評估、物流
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
12
檢驗、保險、評估、物流