描述
Die Bonder配置
無配置OEM 代工型號說明
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文檔
無文檔
ASM
AD8912
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115626
晶圓尺寸:
6"/150mm, 12"/300mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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AD8912
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115626
晶圓尺寸:
6"/150mm, 12"/300mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Die Bonder配置
無配置OEM 代工型號說明
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文檔
無文檔