描述
Cu Barrier Seed depostion配置
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM 代工型號說明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文檔
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LAM RESEARCH / NOVELLUS
INOVA
已驗證
類別
Deposition
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
50644
晶圓尺寸:
12"/300mm
年份:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
INOVA
已驗證
類別
Deposition
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
50644
晶圓尺寸:
12"/300mm
年份:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Cu Barrier Seed depostion配置
Software Version: 5.65 CIM: SECS/GEM Process: TFM_Cu Barrier Seed_NovellusOEM 代工型號說明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文檔
無文檔