描述
Cu Barrier Seed depostion配置
MDX83x, underutilized in FAB8, considered for FAB1 transferOEM 代工型號說明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文檔
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LAM RESEARCH / NOVELLUS
INOVA
已驗證
類別
Deposition
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
95996
晶圓尺寸:
12"/300mm
年份:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
INOVA
已驗證
類別
Deposition
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
95996
晶圓尺寸:
12"/300mm
年份:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Cu Barrier Seed depostion配置
MDX83x, underutilized in FAB8, considered for FAB1 transferOEM 代工型號說明
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文檔
無文檔