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LAM RESEARCH / NOVELLUS INOVA
    描述
    無描述
    配置
    Ti-A1 Physical Vapor Deposition Machine
    OEM 代工型號說明
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
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    LAM RESEARCH / NOVELLUS

    INOVA

    verified-listing-icon

    已驗證

    類別
    Deposition

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    75594


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Deposition
    年份: 2012條件: 二手
    上次驗證超過60天前

    LAM RESEARCH / NOVELLUS

    INOVA

    verified-listing-icon
    已驗證
    類別
    Deposition
    上次驗證: 超過60天前
    listing-photo-e8a3414fc4ae4d72b722ecefecfab3c1-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    75594


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    Ti-A1 Physical Vapor Deposition Machine
    OEM 代工型號說明
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
    文檔

    無文檔

    類似上架商品
    查看全部
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Deposition年份: 2012條件: 二手上次驗證:超過60天前
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Deposition年份: 1999條件: 二手上次驗證:超過60天前
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    Deposition年份: 2012條件: 二手上次驗證:超過60天前