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KLA AIT XUV
  • KLA AIT XUV
  • KLA AIT XUV
描述
Darkfield inspection
配置
-Factory Interface: FOUP (2)
OEM 代工型號說明
The AIT XUV is KLA-Tencor’s next-generation double-darkfield optical inspection tool. It offers higher throughput and sensitivity for 65-nm production requirements, with a wide range of spot sizes and advanced detection algorithms. It also features an auto-positioning system, autofocus unit, and iADC capability for faster results. It is field upgradeable from the AIT UV platform and provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system, with improved focus, tracking performance, and die-to-die registration.
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已驗證

類別
Defect Inspection

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

113030


晶圓尺寸:

12"/300mm


年份:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

AIT XUV

verified-listing-icon
已驗證
類別
Defect Inspection
上次驗證: 超過60天前
listing-photo-5748f905934d40fd9ab885172dcb6466-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/79476/5748f905934d40fd9ab885172dcb6466/ccff370bc1204470a619239327fa8a85_3bcde7885b51422490f8c60f9a86e1561201a_mw.jpeg
listing-photo-5748f905934d40fd9ab885172dcb6466-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/79476/5748f905934d40fd9ab885172dcb6466/76148c5ec55d45019af7a44d7827b15b_7dd22bc34f5648628825c345ebc4ea151201a_mw.jpeg
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

113030


晶圓尺寸:

12"/300mm


年份:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Darkfield inspection
配置
-Factory Interface: FOUP (2)
OEM 代工型號說明
The AIT XUV is KLA-Tencor’s next-generation double-darkfield optical inspection tool. It offers higher throughput and sensitivity for 65-nm production requirements, with a wide range of spot sizes and advanced detection algorithms. It also features an auto-positioning system, autofocus unit, and iADC capability for faster results. It is field upgradeable from the AIT UV platform and provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system, with improved focus, tracking performance, and die-to-die registration.
文檔

無文檔