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描述
DEP TOOL配置
Please see attached...OEM 代工型號說明
The AMAT CENTURA AP ULTIMA X is a high-density plasma chemical vapor deposition (CVD) system designed for semiconductor manufacturing in both 200mm and 300mm configurations. As an industry-leading workhorse, it excels in delivering high-quality dielectric films and void-free gap fill, crucial for advanced chip fabrication. The system's dual RF coils provide superior gap-fill capability across the wafer, while its innovative electrostatic chuck ensures excellent film quality and uniformity. Combined with remote plasma clean technology, it achieves exceptional defect control and improved mean-wafer-between-clean performance. The Ultima HDP system's advanced technology enables deposition of both undoped and doped films, catering to various applications such as shallow trench isolation (STI), pre-metal dielectric (PMD), interlayer dielectric (ILD), inter-metal dielectric (IMD), and passivation. Its versatility also extends to etchback and high-density plasma treatments, enhancing film quality in semiconductor manufacturing processes.文檔
類別
CVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled / Crated
產品編號:
101680
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
Centura AP Ultima X
類別
CVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled / Crated
產品編號:
101680
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available