跳到主要內容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情

Moov logo

Moov Icon
APPLIED MATERIALS (AMAT) AMP 3300
  • APPLIED MATERIALS (AMAT) AMP 3300
  • APPLIED MATERIALS (AMAT) AMP 3300
  • APPLIED MATERIALS (AMAT) AMP 3300
描述
FTG HOSE CONN 1/2H X 1/2MNPT SST
配置
無配置
OEM 代工型號說明
AMP 3300 PLASMA DEPOSITION SYSTEMS Superior film qualities, both nitride and oxide, guaranteed uniformities, and proven reliability have made the AMP 3300 popular for a wide range of plasma passivation and interlayer applications. Recent process developments have led to an improved method of gas distribution employing a perforated electrode. This provides for uniform gas composition across the entire wafer platen, resulting in consistent film characteristics on every wafer.
文檔

無文檔

類別
CVD

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

109312


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

AMP 3300

verified-listing-icon
已驗證
類別
CVD
上次驗證: 超過60天前
listing-photo-efacd524bff6411c978bd618cbb2fb6e-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

109312


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
FTG HOSE CONN 1/2H X 1/2MNPT SST
配置
無配置
OEM 代工型號說明
AMP 3300 PLASMA DEPOSITION SYSTEMS Superior film qualities, both nitride and oxide, guaranteed uniformities, and proven reliability have made the AMP 3300 popular for a wide range of plasma passivation and interlayer applications. Recent process developments have led to an improved method of gas distribution employing a perforated electrode. This provides for uniform gas composition across the entire wafer platen, resulting in consistent film characteristics on every wafer.
文檔

無文檔