描述
無描述配置
Work size: 50-300 mm Wire diameter: 15-50 µm Interface: SECS II / GEM Bump placement accuracy: ±3.5 µm 2D Barcode reading Wafer mapping Vertical wire looping process Cu Wire bonding Au Wire: 0.6 to 2.0 mil Cu Wire: 0.7 to 1.5 mil LCD Monitor, 17" Lamp indicator: Tower type Hard Disk Drive (HDD) USB Driver Manuals included Noise level: 80 dB Maximum power consumption: 1.4 kVA Power supply: 100-240 VAC, Single phase, 30 A, 50/60 HzOEM 代工型號說明
Ball bonder, advanced wafer level bonding applications.文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
133746
晶圓尺寸:
未知
年份:
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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類別
Wire / Wedge / Ball Bonder
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
133746
晶圓尺寸:
未知
年份:
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Work size: 50-300 mm Wire diameter: 15-50 µm Interface: SECS II / GEM Bump placement accuracy: ±3.5 µm 2D Barcode reading Wafer mapping Vertical wire looping process Cu Wire bonding Au Wire: 0.6 to 2.0 mil Cu Wire: 0.7 to 1.5 mil LCD Monitor, 17" Lamp indicator: Tower type Hard Disk Drive (HDD) USB Driver Manuals included Noise level: 80 dB Maximum power consumption: 1.4 kVA Power supply: 100-240 VAC, Single phase, 30 A, 50/60 HzOEM 代工型號說明
Ball bonder, advanced wafer level bonding applications.文檔
無文檔