描述
無描述配置
無配置OEM 代工型號說明
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.文檔
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ASM
EAGLE XPRESS GOCU
已驗證
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114003
晶圓尺寸:
未知
年份:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XPRESS GOCU
類別
Wire / Wedge / Ball Bonder
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114003
晶圓尺寸:
未知
年份:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.文檔
無文檔