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EAGLE XPRESS GOCU
概述
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.
活躍中的上架商品
2
服務
檢驗、保險、評估、物流
