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LAM RESEARCH / SEZ SP4300
  • LAM RESEARCH / SEZ SP4300
  • LAM RESEARCH / SEZ SP4300
  • LAM RESEARCH / SEZ SP4300
描述
Single Wafer Processing
配置
無配置
OEM 代工型號說明
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.
文檔

無文檔

類別
Wet Etch

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

48208


晶圓尺寸:

12"/300mm


年份:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH / SEZ

SP4300

verified-listing-icon
已驗證
類別
Wet Etch
上次驗證: 超過60天前
listing-photo-b4d0f45da1da48ec9cc68963c7233d27-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

48208


晶圓尺寸:

12"/300mm


年份:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Single Wafer Processing
配置
無配置
OEM 代工型號說明
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.
文檔

無文檔