描述
無描述配置
-400v -75A -50/60HZ Technical Data: -Dimension WxDxH: 2800x4150x2450 mm -Handling Device: Dual Arm Robot on Linear Tracking System -Process Chambers: Four Multi-Level Process Chambers double sided wafer treatment -Chemical Cabinet: Integrated in Main Unit -Software: Windows NTOEM 代工型號說明
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.文檔
無文檔
LAM RESEARCH / SEZ
SP4300
已驗證
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59806
晶圓尺寸:
12"/300mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
SP4300
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59806
晶圓尺寸:
12"/300mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
-400v -75A -50/60HZ Technical Data: -Dimension WxDxH: 2800x4150x2450 mm -Handling Device: Dual Arm Robot on Linear Tracking System -Process Chambers: Four Multi-Level Process Chambers double sided wafer treatment -Chemical Cabinet: Integrated in Main Unit -Software: Windows NTOEM 代工型號說明
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.文檔
無文檔