描述
無描述配置
3 chamber typeOEM 代工型號說明
SSEC 3300 family of cutting-edge wet cleaners and processors, tailored to specific applications including cleaning, coating, developing, etching, and solvent processing, these systems operate within an entirely digital environment, ensuring unparalleled precision and efficiency. Engineered to accommodate wafers up to 300 mm or glass substrates up to 10" square, the Model 3300 ML configurations combine automated processing with manual loading, offering the utmost operator safety even when handling aggressive chemicals, thanks to their dry-in/dry-out design. Choose between bulkhead or ballroom styles, both featuring mini-environments upheld by ULPA filtration for pristine air quality. The chamber, hermetically sealed and backfilled with ULPA filtered air or inert gas, can house up to four drains and accommodate up to six arms—each boasting an array of dispenses, specialized nozzles, or brushes. Elevate your processing with in-situ monitoring and control, empowered by SSEC's exclusive WaferChek™ system, enabling meticulous command over process completion and meticulous logging of processing quality. Upgrade your semiconductor fabrication with the SSEC 3300, where innovation meets immaculate precision.文檔
無文檔
SSEC
3300
已驗證
類別
Wafer Scrubber
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
83619
晶圓尺寸:
6"/150mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SSEC
3300
類別
Wafer Scrubber
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
83619
晶圓尺寸:
6"/150mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
3 chamber typeOEM 代工型號說明
SSEC 3300 family of cutting-edge wet cleaners and processors, tailored to specific applications including cleaning, coating, developing, etching, and solvent processing, these systems operate within an entirely digital environment, ensuring unparalleled precision and efficiency. Engineered to accommodate wafers up to 300 mm or glass substrates up to 10" square, the Model 3300 ML configurations combine automated processing with manual loading, offering the utmost operator safety even when handling aggressive chemicals, thanks to their dry-in/dry-out design. Choose between bulkhead or ballroom styles, both featuring mini-environments upheld by ULPA filtration for pristine air quality. The chamber, hermetically sealed and backfilled with ULPA filtered air or inert gas, can house up to four drains and accommodate up to six arms—each boasting an array of dispenses, specialized nozzles, or brushes. Elevate your processing with in-situ monitoring and control, empowered by SSEC's exclusive WaferChek™ system, enabling meticulous command over process completion and meticulous logging of processing quality. Upgrade your semiconductor fabrication with the SSEC 3300, where innovation meets immaculate precision.文檔
無文檔