
The SSEC 3303/4 systems are distinguished by their full automation and capacity to accommodate up to four processing modules. These systems come equipped with the flexibility of one, two, or three handling robots to guarantee efficient, high-volume operations, even when managing intricate serial procedures. With an option to choose from the sturdy bulkhead style or the spacious ballroom style, these systems demonstrate great versatility. Notably, the tooling incorporated in these systems can effortlessly support wafers of up to 300mm, further enhancing their adaptability in the semiconductor manufacturing industry. The 3303/4 systems exemplify SSEC's commitment to delivering top-tier, flexible solutions for diverse operational needs.

SSEC / VEECO

M3303

the SSEC 3300 family of cutting-edge wet cleaners and processors. Engineered with singular wafer technology, these systems boast application-specific configurations catering to every facet of semiconductor fabrication – from meticulous cleaning and precise coating to intricate development, etching, and solvent processing – all within an entirely digital realm. Supporting wafers up to 300 mm, the Model 3301/2 variants stand as paragons of automation, ensuring operator safety even when handling the most aggressive chemistries through their dry-in/dry-out design. With the option to integrate up to two processing modules, flexibility meets efficiency. Choose between bulkhead or ballroom styles, both employing ULPA filtration to process air within the mini-environment, while the onboard bulk chemical management and blending capability enhances cost-effectiveness, enabling operations with chemistry diluted from concentrated bulk supplies. Adhering to SEMI® ergonomic standards, wafers can be deftly managed in cassettes using horizontal cassette loaders, SMIFs, or standard 300 mm FOUP openers. Redefine possibility – embrace the future with SSEC 3300.

M3302

 SSEC 3300 family of cutting-edge wet cleaners and processors, tailored to specific applications including cleaning, coating, developing, etching, and solvent processing, these systems operate within an entirely digital environment, ensuring unparalleled precision and efficiency. Engineered to accommodate wafers up to 300 mm or glass substrates up to 10" square, the Model 3300 ML configurations combine automated processing with manual loading, offering the utmost operator safety even when handling aggressive chemicals, thanks to their dry-in/dry-out design. Choose between bulkhead or ballroom styles, both featuring mini-environments upheld by ULPA filtration for pristine air quality. The chamber, hermetically sealed and backfilled with ULPA filtered air or inert gas, can house up to four drains and accommodate up to six arms—each boasting an array of dispenses, specialized nozzles, or brushes. Elevate your processing with in-situ monitoring and control, empowered by SSEC's exclusive WaferChek™ system, enabling meticulous command over process completion and meticulous logging of processing quality. Upgrade your semiconductor fabrication with the SSEC 3300, where innovation meets immaculate precision.

3300

Engineered for automation and efficiency, the SSEC 3305/6 systems incorporate up to six processing modules, complemented by one, two, or three handling robots, all working synergistically to enable high throughput operation. This setup excels even in managing complex serial processes. These systems present a choice between the robust bulkhead style or the spacious ballroom style, catering to various user preferences. Furthermore, they are designed to support wafers up to 300mm, proving their adaptability and capability in addressing the multifaceted needs of the semiconductor manufacturing sector.

M3305

M3300

M3304

3300 ML

3302

M3306

The SSEC 3308/12 systems are entirely automatic, equipped with a maximum of twelve processing modules and the option of one, two, or three handling robots to facilitate high-capacity operations, inclusive of intricate serial processes. These systems are versatile in their design, available in either the bulkhead or the ballroom styles. Moreover, they are capable of supporting wafer sizes up to 300mm, which showcases their adaptability in handling diverse semiconductor manufacturing tasks.

M3308

M300ML

3308

EVERGREEN M200

EVERGREEN 50

156 SC

3204

EVERGREEN PE / 204

EVERGREEN M20

EVERGREEN

1756

3100

EVERGREEN SERIES II 203

300 ML EVERGREEN SERIES III

EVERGREEN II

M330X

Wafer Spin Coater Developer Photo Resist 

M3307

M 300

single and double-sided single wafer cleaning technology achieves high efficiency particle removal for many applications. Veeco’s patented double-sided PVA brush systems cleans top, bottom and side surfaces. Additional single-sided PVA brush scrubbing technologies are available along with High Velocity Spray (HVS) and Megasonics for the most effective cleaning results on all wafer sizes.

M3306-12

3203

3304 SC1

SSEC / VEECO

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M3303

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M3302

M3305

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