描述
無描述配置
Two modules: -First module, the wafer is soaked in the mix of solvents (cleaning by submersion). -Second module, there is processing by spray solvents (Fan Spray Processing) and nitrogen drying stage. As solvents N- methylpyrrolidone (NMP) and isopropyl alcohol (IPA) were used. The unit has dry-in/dry-out system (dry wafers in/ dry wafers out)OEM 代工型號說明
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SSEC
3302
已驗證
類別
Wafer Scrubber
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
24600
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SSEC
3302
類別
Wafer Scrubber
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
24600
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Two modules: -First module, the wafer is soaked in the mix of solvents (cleaning by submersion). -Second module, there is processing by spray solvents (Fan Spray Processing) and nitrogen drying stage. As solvents N- methylpyrrolidone (NMP) and isopropyl alcohol (IPA) were used. The unit has dry-in/dry-out system (dry wafers in/ dry wafers out)OEM 代工型號說明
未提供文檔
無文檔