描述
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU board配置
無配置OEM 代工型號說明
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文檔
無文檔
OKAMOTO
GNX 300
類別
Wafer Grinding
上次驗證: 13 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
143426
晶圓尺寸:
12"/300mm
年份:
2003
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU board配置
無配置OEM 代工型號說明
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文檔
無文檔