描述
WAFER GRINDING / GNX200 from ATK(CR17035 L*W*H (cm) -140x255x180 Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um.配置
無配置OEM 代工型號說明
Grinder文檔
無文檔
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OKAMOTO
GNX 200
類別
Wafer Grinding
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
143420
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
WAFER GRINDING / GNX200 from ATK(CR17035 L*W*H (cm) -140x255x180 Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um.配置
無配置OEM 代工型號說明
Grinder文檔
無文檔