We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
描述
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kg配置
無配置OEM 代工型號說明
Discontinued Mar. 2006文檔
無文檔
DISCO
DFG860
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79180
晶圓尺寸:
未知
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kg配置
無配置OEM 代工型號說明
Discontinued Mar. 2006文檔
無文檔