描述
無描述配置
Process: Backgrinding Mode: Fully-autoOEM 代工型號說明
Discontinued Mar. 2006文檔
無文檔
DISCO
DFG860
已驗證
類別
Wafer Grinding
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
63108
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFG860
類別
Wafer Grinding
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
63108
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Process: Backgrinding Mode: Fully-autoOEM 代工型號說明
Discontinued Mar. 2006文檔
無文檔