描述
無描述配置
無配置OEM 代工型號說明
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.文檔
無文檔
DISCO
DFG8340
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
126262
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.文檔
無文檔