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描述
無描述配置
無配置OEM 代工型號說明
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.文檔
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PREFERRED
SELLER
DISCO
DFG8340
類別
Wafer Grinding
上次驗證: 13 天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
125549
晶圓尺寸:
未知
年份:
未知
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描述
無描述配置
無配置OEM 代工型號說明
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.文檔
無文檔