描述
Suss Wafer Bonder配置
無配置OEM 代工型號說明
SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB8 Gen2 - from pieces up to 200mm wafers. Wafer Bonder文檔
無文檔
類別
Wafer Bonders
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129248
晶圓尺寸:
未知
年份:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
SB8 Gen2
類別
Wafer Bonders
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129248
晶圓尺寸:
未知
年份:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Suss Wafer Bonder配置
無配置OEM 代工型號說明
SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB8 Gen2 - from pieces up to 200mm wafers. Wafer Bonder文檔
無文檔