描述
Wafer Bonder配置
Wafer BonderOEM 代工型號說明
Up to 200 mm Wafer Bonding文檔
無文檔
SUSS MicroTec / KARL SUSS
CB200M
已驗證
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
43269
晶圓尺寸:
8"/200mm
年份:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
CB200M
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
43269
晶圓尺寸:
8"/200mm
年份:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Bonder配置
Wafer BonderOEM 代工型號說明
Up to 200 mm Wafer Bonding文檔
無文檔