
描述
Automated Bonding System配置
無配置OEM 代工型號說明
The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.文檔
類別
Wafer Bonders
上次驗證: 4 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
145564
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG560
類別
Wafer Bonders
上次驗證: 4 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
145564
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available