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EVGroup (EVG) EVG850 TB
    描述
    Sapphire to GaAs wafer bonding
    配置
    無配置
    OEM 代工型號說明
    The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes. Wafer Bonder
    文檔

    EVGroup (EVG)

    EVG850 TB

    verified-listing-icon

    已驗證

    類別
    Wafer Bonders

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    82029


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders
    年份: 2012條件: 二手
    上次驗證超過60天前

    EVGroup (EVG)

    EVG850 TB

    verified-listing-icon
    已驗證
    類別
    Wafer Bonders
    上次驗證: 超過60天前
    listing-photo-eadea610f9fd4d3bb5ddff78f7236b19-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    82029


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Sapphire to GaAs wafer bonding
    配置
    無配置
    OEM 代工型號說明
    The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes. Wafer Bonder
    文檔
    類似上架商品
    查看全部
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders年份: 2012條件: 二手上次驗證:超過60天前
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders年份: 0條件: 二手上次驗證:超過60天前
    EVGroup (EVG) EVG850 TB

    EVGroup (EVG)

    EVG850 TB

    Wafer Bonders年份: 2001條件: 二手上次驗證:超過60天前