描述
無描述配置
無配置OEM 代工型號說明
The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.文檔
無文檔
類別
Wafer Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
83923
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
ТВМ-8
類別
Wafer Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
83923
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.文檔
無文檔