We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
描述
無描述配置
Fusion Bonding System with Megasonic Cleaner, Plasma Activation, Flat Finder, IR Camera and Bond Chamber,OEM 代工型號說明
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonder文檔
無文檔
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
120049
晶圓尺寸:
未知
年份:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 LT
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
120049
晶圓尺寸:
未知
年份:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Fusion Bonding System with Megasonic Cleaner, Plasma Activation, Flat Finder, IR Camera and Bond Chamber,OEM 代工型號說明
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonder文檔
無文檔