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描述
無描述配置
BonderOEM 代工型號說明
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder文檔
無文檔
類別
Wafer Bonders
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled / Uncrated
產品編號:
116672
晶圓尺寸:
未知
年份:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG520 HE
類別
Wafer Bonders
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled / Uncrated
產品編號:
116672
晶圓尺寸:
未知
年份:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
BonderOEM 代工型號說明
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder文檔
無文檔