描述
WAFER BONDING配置
無配置OEM 代工型號說明
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.文檔
無文檔
EVGroup (EVG)
GEMINI FB
已驗證
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107777
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
GEMINI FB
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107777
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
WAFER BONDING配置
無配置OEM 代工型號說明
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.文檔
無文檔