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無描述配置
- Anodic - Pre-Fusion - Glass Frit - Thermal Compression - Both Ambient and Vacuum Bonding CapabilitiesOEM 代工型號說明
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EVGroup (EVG)
EV 501S
已驗證
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
50460
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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查看全部EVGroup (EVG)
EV 501S
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
50460
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
- Anodic - Pre-Fusion - Glass Frit - Thermal Compression - Both Ambient and Vacuum Bonding CapabilitiesOEM 代工型號說明
Wafer Bonder文檔
無文檔