描述
FT-IR配置
無配置OEM 代工型號說明
The QS1200 is a desktop FTIR metrology tool designed for advanced semiconductor fabs. It is used for dopant monitoring, epi thickness measurement, and other applications. The tool can accommodate SEMI standard wafers of 100, 125, 150, 200, and 300mm diameter, as well as odd shaped wafer pieces and 2mm thick silicon slices. An optional single wafer mapping stage is available for all wafer sizes. The QS1200 also features unique algorithms for instant qualification of SOI, SiC, and other epitaxial films. Its built-in intelligence extends its applicability to almost every film material imaginable. Additionally, it is versatile enough to qualify the thickness of recycled test wafers for rapid payback. This tool provides a new level of integration of the FTIR technique utilizing proven optical technology.文檔
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ONTO / NANOMETRICS / ACCENT / BIO-RAD
QS1200
已驗證
類別
Spectrometer / SIMS
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115142
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ONTO / NANOMETRICS / ACCENT / BIO-RAD
QS1200
類別
Spectrometer / SIMS
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115142
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
FT-IR配置
無配置OEM 代工型號說明
The QS1200 is a desktop FTIR metrology tool designed for advanced semiconductor fabs. It is used for dopant monitoring, epi thickness measurement, and other applications. The tool can accommodate SEMI standard wafers of 100, 125, 150, 200, and 300mm diameter, as well as odd shaped wafer pieces and 2mm thick silicon slices. An optional single wafer mapping stage is available for all wafer sizes. The QS1200 also features unique algorithms for instant qualification of SOI, SiC, and other epitaxial films. Its built-in intelligence extends its applicability to almost every film material imaginable. Additionally, it is versatile enough to qualify the thickness of recycled test wafers for rapid payback. This tool provides a new level of integration of the FTIR technique utilizing proven optical technology.文檔
無文檔