描述
無描述配置
Specifications: Electron Source – TFE Elstar electron column with UC monochromator Ion Source – Tomahawk • Landing Voltage – 50 V - 30 kV SEM – 500 V - 30 kV FIB • STEM resolution – 0.8 nm • SEM resolution – Optimal WD 0.8 nm @ 15 kV 0.8 nm @ 2 kV 0.9 nm @ 1 kV 1.5 nm @ 200 V with beam decleration – Coincident WD 0.8 nm @ 15 kV 0.9 nm @ 5 kV 1.2 nm @ 1 kV • Ion beam resolution at coincident point – 4.5 nm @ 30 kV using preferred statistical method – 2.5 nm @ 30 kV using selective edge method 2 • EDS resolution – < 30 nm on thinned sample • Stage – 5 axis all piezo motorized – 100 mm XY motion – Loadlock (80 mm max. diameter) – Omniprobe • Sample types – Wafer pieces, packaged parts, TEM – grids, whole wafers up to 100 mm • Max. sample size – 80 mm diameter with full travel • User interface – Windows® GUI with integrated SEM, FIB, GIS, and simultaneous patterning and imaging mode • GIS – available and on request • Lift out – Omniprobe 200.2OEM 代工型號說明
未提供文檔
無文檔
類別
SEM / FIB
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
117689
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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THERMOFISHER SCIENTIFIC / FEI / PHILIPS
HELIOS NANOLAB 450S
類別
SEM / FIB
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
117689
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Specifications: Electron Source – TFE Elstar electron column with UC monochromator Ion Source – Tomahawk • Landing Voltage – 50 V - 30 kV SEM – 500 V - 30 kV FIB • STEM resolution – 0.8 nm • SEM resolution – Optimal WD 0.8 nm @ 15 kV 0.8 nm @ 2 kV 0.9 nm @ 1 kV 1.5 nm @ 200 V with beam decleration – Coincident WD 0.8 nm @ 15 kV 0.9 nm @ 5 kV 1.2 nm @ 1 kV • Ion beam resolution at coincident point – 4.5 nm @ 30 kV using preferred statistical method – 2.5 nm @ 30 kV using selective edge method 2 • EDS resolution – < 30 nm on thinned sample • Stage – 5 axis all piezo motorized – 100 mm XY motion – Loadlock (80 mm max. diameter) – Omniprobe • Sample types – Wafer pieces, packaged parts, TEM – grids, whole wafers up to 100 mm • Max. sample size – 80 mm diameter with full travel • User interface – Windows® GUI with integrated SEM, FIB, GIS, and simultaneous patterning and imaging mode • GIS – available and on request • Lift out – Omniprobe 200.2OEM 代工型號說明
未提供文檔
無文檔