描述
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.配置
無配置OEM 代工型號說明
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.文檔
無文檔
DISCO
DFL7362
類別
Scribing, Cutting, Dicing
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
128847
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.配置
無配置OEM 代工型號說明
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.文檔
無文檔