描述
無描述配置
無配置OEM 代工型號說明
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.文檔
無文檔
DISCO
DFL7341
類別
Scribing, Cutting, Dicing
上次驗證: 16 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152281
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.文檔
無文檔