描述
Wafer Saw配置
無配置OEM 代工型號說明
Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.文檔
無文檔
DISCO
DFD681
已驗證
類別
Scribing, Cutting, Dicing
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
74929
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD681
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
74929
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Saw配置
無配置OEM 代工型號說明
Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.文檔
無文檔