DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

A space-saving solution for Φ300 mm dicing

16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.

DISCO

DFD6560

Scribing, Cutting, Dicing

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