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描述
無描述配置
無配置OEM 代工型號說明
2017 Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers. A space-saving solution for Φ300 mm dicing 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.文檔
無文檔
DISCO
DFD6560
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
84221
晶圓尺寸:
未知
年份:
2012
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描述
無描述配置
無配置OEM 代工型號說明
2017 Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers. A space-saving solution for Φ300 mm dicing 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.文檔
無文檔