描述
無描述配置
Process: Wafer Dicing Mode: Fully-autoOEM 代工型號說明
Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation文檔
無文檔
DISCO
DFD6450
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 4 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116470
晶圓尺寸:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD6450
類別
Scribing, Cutting, Dicing
上次驗證: 4 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116470
晶圓尺寸:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Process: Wafer Dicing Mode: Fully-autoOEM 代工型號說明
Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation文檔
無文檔