描述
**DISCO DFD641 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD641 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Single Spindle * Maximum Wafer Size: 8-inch (200 mm) **Features** * Automatic wafer frame loading and unloading * Automatic wafer alignment * Fully automatic dicing process * Automatic cleaning and drying * High-output, low-vibration spindle system * Suitable for semiconductor wafer dicing applications *Technical specifications and options should be confirmed according to the actual machine configuration.*配置
無配置OEM 代工型號說明
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.文檔
無文檔
類似上架商品
查看全部
DISCO
DFD641
類別
Scribing, Cutting, Dicing
上次驗證: 8 天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
153614
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
**DISCO DFD641 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD641 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Single Spindle * Maximum Wafer Size: 8-inch (200 mm) **Features** * Automatic wafer frame loading and unloading * Automatic wafer alignment * Fully automatic dicing process * Automatic cleaning and drying * High-output, low-vibration spindle system * Suitable for semiconductor wafer dicing applications *Technical specifications and options should be confirmed according to the actual machine configuration.*配置
無配置OEM 代工型號說明
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.文檔
無文檔